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Proposal from Shin-Etsu Polymer
We support "Solder-Free Inter-Connection" for "Eco-Design"
Solder-free connection proposed by Shin-Etsu is an ideal Inter-Connect solution to promote "Reuse & Repair" after disassembly. We proceed with an ideology of "Global environment-friendly (Eco-Design)." As proven in Mobile, Medical, Space Science and other fields, we are rolling out this "Solder-Free Inter-Connection" to highdensity mounting of automotive parts.
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Broad to Broad Connection: |
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Applications:
Air conditioner, Audio, Room mirror, sensors, wireless communication, and other automotive modules.
Highlight:
High density interconnection at less than 0.5mm electrode pitch with high degree of compliance and shock absorbance to ensure reliable connection.
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Glass Substrate to PCB Connection: |
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Applications:
Glass heater, Antenna, Flat Panel Display. etc.
Highlight:
Z-axis interconnector is ideal solution for parts with glass substrate. For design flexibilities, heat-seal connector provides higher degree of design freedom.
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Mounting of Electrical Parts: |
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Applications:
MIC, Speaker, and other telematics related modules.
Highlight:
Microphone, speaker and other electrical components can be attached to Shin-Etsu inter-connector for easy PCB mounting. No soldering is required.
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Telecommunications
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