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 GX4 Type
Sheet type inter-connector with higher density embedded metal wire.
Ideal interconnect solution for the testing of ultra fine pitch devices (Flip Chip, Bumped Wafer)

Outline Dimensions:
*Unlike MT type, GX4 does not require to have offset.
Dimensions and Tolerances:
 Pitch (mm) Pi : 0.042±0.015 × Ps : 0.046±0.015
 Length (mm) Max : 30 ± 1.0   Min : 5 ± 0.5
 Width (mm) Max : 30 ± 1.0   Min : 5 ± 0.5
 Thickness (mm) 1.0 ±0.025, 0.5 ±0.025
Compression Load vs. Deflection Amount:

Usage Example of Mobile Phone Usage Example of VC-Film Shin-Etsu Polymer America, Inc. Company Information Shin-Etsu Polymer Green Activities
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