Sheet type inter-connector with higher density embedded metal wire. Ideal interconnect solution for the testing of ultra fine pitch devices (Flip Chip, Bumped Wafer)

Outline Dimensions:

*Unlike MT type, GX4 does not require to have offset.

Dimensions and Tolerances:

Pitch (mm) Pi : 0.042±0.015 × Ps : 0.046±0.015  Length (mm) Max : 30 ± 1.0   Min : 5 ± 0.5  Width (mm) Max : 30 ± 1.0   Min : 5 ± 0.5  Thickness (mm) 1.0 ±0.025, 0.5 ±0.025

Compression Load vs. Deflection Amount: