Shin-Etsu Lightframe® Shin-Etsu Lightframe reduces conductive particles by using metal tape frame and improves the reliability for packages. Characteristics: Conductive particles reduction Light weight Ease of operation [...]
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So far shinpoly has created 27 blog entries.
FOUP 300EX We mainly provide wafer containers and other semiconductor-related packaging and carrying materials created using world-leading technologies including materials development, precision molding and evaluation. Wafer manufacturers use wafer [...]
Capacitive Touch Sensor Shin-Etsu Polymer developed a range of touch sensors based on various conductive materials printed or deposited on ultra thin films. The conductive materials are developed for [...]