We mainly provide wafer containers and other semiconductor-related packaging and carrying materials created using world-leading technologies including materials development, precision molding and evaluation.
Wafer manufacturers use wafer shipping boxes for wafer shipments, and device manufacturers use front opening unified pods (“FOUP”) to hold wafers during process handling. Shin-Etsu Polymer’s wafer shipping boxes and “FOUP” products have an excellent track record.
Technological strengths include evaluation technologies such as material engineering and wafer investigation, clean environment control, precision molding and design that precisely meet evolving customer requirements. As the leading supplier of semiconductor- related wafer containers, Shin-Etsu Polymer maintains a large share of the 300mm front-opening shipping box (“FOSB”) and “FOUP” wafer container markets.